X射线分辨率测试卡/微纳CT评估模体

微纳X射线分辨率测试卡

X射线分辨率测试卡是测量成像系统成像质量的重要工具,我司可提供各种类型的测试卡以满足您的各种需求。图案类型包括线对、孔阵列和西门子星等。

  • 产地: 瑞士
  • 型号:
  • 品牌: XRnanotech

X射线分辨率测试卡是测量成像系统成像质量的重要工具,我司可提供各种类型的测试卡以满足您的各种需求。图案类型包括线对、孔阵列和西门子星等。


1. Nanostructured 2D Resolution Test Target

2D Resolution Test Target Layout

Choose from the variants to suit your specific requirements:

•50 nm Au: Pure gold structures offering precise, high-resolution imaging.

•30 nm Au/Ir Hybrid: A blend of materials for enhanced detail.

•20 nm Au/Ir Hybrid: Ultra-fine structures for specialized imaging needs.

•10 nm Au/Ir Hybrid: Our most precise structures for those pushing the limits of nano-imaging.

General Design as below:

北京众星联恒科技有限公司

Blue structures are made from Iridium for the relevant resolution test targets.

Substrate:

6 mm x 6 mm x 0.25 mm

silicon chip with

2 mm x 2 mm x 250 nm Si3N4 window

Geometries include:

nested L-shape structures

Siemens star test patterns

other geometries according to design sketch

1.1 Nanostructured 2D Resolution Test Target (50 nm) made from Au

The parameters are as follows:

Gold height > 800 nm

Smallest Feature size of Au ca. 50 nm

1.2 Nanostructured 2D Resolution Test Target (30 nm) made from Au and Ir

The parameters are as follows:

Smallest Feature size of Ir ca.30 nm

Material height: >500 nm

Gold height > 500 nm

Smallest Feature size of Au ca. 50 nm

1.3 Nanostructured 2D Resolution Test Target (20 nm) made from Au and Ir

The parameters are as follows:

Smallest Feature size of Ir ca.20 nm

Material height: >300 nm

Gold height > 500 nm

Smallest Feature size of Au ca. 50 nm

1.4 Nanostructured 2D Resolution Test Target (10 nm) made from Au and Ir

The parameters are as follows:

Smallest Feature size of Ir ca.10 nm

Material height: >100 nm

Gold height > 500 nm

Smallest Feature size of Au ca. 50 nm

MOUNTING (optional)

XRnanotech will mount chip on holder provided by customer

OR

XRnanotech will mount chip on XRnanotech standard holder.

2. MicroCT Test Target

2.1 MicroCT Test Target(4μm tall)

Material                                   Gold

Smallest Feature size (nm)     300/400

Material Height                       >= 4.0 μm

Silicon chip dimensions          9 mm x 9mm x 0.25mm

Window dimensions               3 mm x 3 mm x 250 nm

Window material                    SiN

Structure Sizes[μm]:               ~ (0.30, 0.35) , 0.40, 0.45, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.25, 1.5, 2.0, 3.0, 3.5,4.0, 5.0, 6.0, 7.0, 8.0, 9.0, 10.0, 11.0, 12.0, 13.0 and 14.0

北京众星联恒科技有限公司

2.2 MicroCT Test Target(1.5μm tall)

Material                                   Gold

Smallest Feature size (nm)     200/400

Material Height                       1500nm

Silicon chip dimensions          9 mm x 9mm x 0.25mm

Window dimensions               3 mm x 3 mm x 250 nm

Window material                    SiN

Structure Sizes[μm]:               50, 40, 30, 20, 15, 10, 8, 6, 5, 4, 3, 2, 1.5, 1, 0.8, 0.6, 0.5, 0.4 , (0.35, 0.3, 0.25, 0.2)北京众星联恒科技有限公司

2.3 MicroCT Test Target(1.0μm tall)

Material                                   Gold

Smallest Feature size (nm)     100

Material Height                       1000nm

Silicon chip dimensions          9 mm x 9mm x 0.25mm

Window dimensions               3 mm x 3 mm x 250 nm

Window material                    SiN

Structure Sizes[μm]:               50, 40, 30, 20, 15, 10, 8, 6, 5, 4, 3, 2, 1.5, 1, 0.8, 0.6, 0.5, 0.4 , 0.35, 0.3, 0.25, 0.2, 0.15, 0.1

北京众星联恒科技有限公司

2.4 MicroCT Test Target(20-300μm)

Material                                   Gold

Smallest Feature size              20μm

Material Height                       1.5μm

Silicon chip dimensions          ~20 mm x 20mm x 0.25mm

Structure Dimensions             15mm x 15mm

Window material                    Si

Structure Sizes[μm]:               300, 250, 200, 150, 75, 50, 40, 30, 20

北京众星联恒科技有限公司

 

Will be delivered mounted on XRnanotech-holder by default.

3. Nanostructured 3D resolution test pattern

Material                                   IP-S or Silicon

Smallest Feature size              will be optimized on a best effort basis towards 200 nm

Material Height                       60μm

Material Diameter                   30μm

Silicon chip dimensions          1mm x 1mm x 0.25mm

 

 





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