Hartmann wavefront sensor plates
2D arrays of holes for wavefront sensing, etched into silicon using deep reactive ion etching technology.
- Model:
2D arrays of holes for wavefront sensing, etched into silicon using deep reactive ion etching technology.
- 2D arrays of holes for wavefront sensing
- Etched into silicon using deep reactive ion etching technology
- Possibilities for high-Z materials (Au, W)
2D silicon holes (pitch: 25 um, holes: 12.5um)
2D silicon holes (pitch: 30 um, holes: 3 um)